cregit-Linux how code gets into the kernel

Release 4.7 include/linux/edac.h

Directory: include/linux
/*
 * Generic EDAC defs
 *
 * Author: Dave Jiang <djiang@mvista.com>
 *
 * 2006-2008 (c) MontaVista Software, Inc. This file is licensed under
 * the terms of the GNU General Public License version 2. This program
 * is licensed "as is" without any warranty of any kind, whether express
 * or implied.
 *
 */
#ifndef _LINUX_EDAC_H_

#define _LINUX_EDAC_H_

#include <linux/atomic.h>
#include <linux/device.h>
#include <linux/completion.h>
#include <linux/workqueue.h>
#include <linux/debugfs.h>

struct device;


#define EDAC_OPSTATE_INVAL	-1

#define EDAC_OPSTATE_POLL	0

#define EDAC_OPSTATE_NMI	1

#define EDAC_OPSTATE_INT	2

extern int edac_op_state;
extern int edac_err_assert;
extern atomic_t edac_handlers;

extern int edac_handler_set(void);
extern void edac_atomic_assert_error(void);
extern struct bus_type *edac_get_sysfs_subsys(void);

enum {
	
EDAC_REPORTING_ENABLED,
	
EDAC_REPORTING_DISABLED,
	
EDAC_REPORTING_FORCE
};

extern int edac_report_status;
#ifdef CONFIG_EDAC

static inline int get_edac_report_status(void) { return edac_report_status; }

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static inline void set_edac_report_status(int new) { edac_report_status = new; }

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#else
static inline int get_edac_report_status(void) { return EDAC_REPORTING_DISABLED; }

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static inline void set_edac_report_status(int new) { }

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#endif
static inline void opstate_init(void) { switch (edac_op_state) { case EDAC_OPSTATE_POLL: case EDAC_OPSTATE_NMI: break; default: edac_op_state = EDAC_OPSTATE_POLL; } return; }

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/* Max length of a DIMM label*/ #define EDAC_MC_LABEL_LEN 31 /* Maximum size of the location string */ #define LOCATION_SIZE 256 /* Defines the maximum number of labels that can be reported */ #define EDAC_MAX_LABELS 8 /* String used to join two or more labels */ #define OTHER_LABEL " or " /** * enum dev_type - describe the type of memory DRAM chips used at the stick * @DEV_UNKNOWN: Can't be determined, or MC doesn't support detect it * @DEV_X1: 1 bit for data * @DEV_X2: 2 bits for data * @DEV_X4: 4 bits for data * @DEV_X8: 8 bits for data * @DEV_X16: 16 bits for data * @DEV_X32: 32 bits for data * @DEV_X64: 64 bits for data * * Typical values are x4 and x8. */ enum dev_type { DEV_UNKNOWN = 0, DEV_X1, DEV_X2, DEV_X4, DEV_X8, DEV_X16, DEV_X32, /* Do these parts exist? */ DEV_X64 /* Do these parts exist? */ }; #define DEV_FLAG_UNKNOWN BIT(DEV_UNKNOWN) #define DEV_FLAG_X1 BIT(DEV_X1) #define DEV_FLAG_X2 BIT(DEV_X2) #define DEV_FLAG_X4 BIT(DEV_X4) #define DEV_FLAG_X8 BIT(DEV_X8) #define DEV_FLAG_X16 BIT(DEV_X16) #define DEV_FLAG_X32 BIT(DEV_X32) #define DEV_FLAG_X64 BIT(DEV_X64) /** * enum hw_event_mc_err_type - type of the detected error * * @HW_EVENT_ERR_CORRECTED: Corrected Error - Indicates that an ECC * corrected error was detected * @HW_EVENT_ERR_UNCORRECTED: Uncorrected Error - Indicates an error that * can't be corrected by ECC, but it is not * fatal (maybe it is on an unused memory area, * or the memory controller could recover from * it for example, by re-trying the operation). * @HW_EVENT_ERR_FATAL: Fatal Error - Uncorrected error that could not * be recovered. */ enum hw_event_mc_err_type { HW_EVENT_ERR_CORRECTED, HW_EVENT_ERR_UNCORRECTED, HW_EVENT_ERR_FATAL, HW_EVENT_ERR_INFO, };
static inline char *mc_event_error_type(const unsigned int err_type) { switch (err_type) { case HW_EVENT_ERR_CORRECTED: return "Corrected"; case HW_EVENT_ERR_UNCORRECTED: return "Uncorrected"; case HW_EVENT_ERR_FATAL: return "Fatal"; default: case HW_EVENT_ERR_INFO: return "Info"; } }

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/** * enum mem_type - memory types. For a more detailed reference, please see * http://en.wikipedia.org/wiki/DRAM * * @MEM_EMPTY Empty csrow * @MEM_RESERVED: Reserved csrow type * @MEM_UNKNOWN: Unknown csrow type * @MEM_FPM: FPM - Fast Page Mode, used on systems up to 1995. * @MEM_EDO: EDO - Extended data out, used on systems up to 1998. * @MEM_BEDO: BEDO - Burst Extended data out, an EDO variant. * @MEM_SDR: SDR - Single data rate SDRAM * http://en.wikipedia.org/wiki/Synchronous_dynamic_random-access_memory * They use 3 pins for chip select: Pins 0 and 2 are * for rank 0; pins 1 and 3 are for rank 1, if the memory * is dual-rank. * @MEM_RDR: Registered SDR SDRAM * @MEM_DDR: Double data rate SDRAM * http://en.wikipedia.org/wiki/DDR_SDRAM * @MEM_RDDR: Registered Double data rate SDRAM * This is a variant of the DDR memories. * A registered memory has a buffer inside it, hiding * part of the memory details to the memory controller. * @MEM_RMBS: Rambus DRAM, used on a few Pentium III/IV controllers. * @MEM_DDR2: DDR2 RAM, as described at JEDEC JESD79-2F. * Those memories are labed as "PC2-" instead of "PC" to * differenciate from DDR. * @MEM_FB_DDR2: Fully-Buffered DDR2, as described at JEDEC Std No. 205 * and JESD206. * Those memories are accessed per DIMM slot, and not by * a chip select signal. * @MEM_RDDR2: Registered DDR2 RAM * This is a variant of the DDR2 memories. * @MEM_XDR: Rambus XDR * It is an evolution of the original RAMBUS memories, * created to compete with DDR2. Weren't used on any * x86 arch, but cell_edac PPC memory controller uses it. * @MEM_DDR3: DDR3 RAM * @MEM_RDDR3: Registered DDR3 RAM * This is a variant of the DDR3 memories. * @MEM_LRDDR3 Load-Reduced DDR3 memory. * @MEM_DDR4: Unbuffered DDR4 RAM * @MEM_RDDR4: Registered DDR4 RAM * This is a variant of the DDR4 memories. */ enum mem_type { MEM_EMPTY = 0, MEM_RESERVED, MEM_UNKNOWN, MEM_FPM, MEM_EDO, MEM_BEDO, MEM_SDR, MEM_RDR, MEM_DDR, MEM_RDDR, MEM_RMBS, MEM_DDR2, MEM_FB_DDR2, MEM_RDDR2, MEM_XDR, MEM_DDR3, MEM_RDDR3, MEM_LRDDR3, MEM_DDR4, MEM_RDDR4, }; #define MEM_FLAG_EMPTY BIT(MEM_EMPTY) #define MEM_FLAG_RESERVED BIT(MEM_RESERVED) #define MEM_FLAG_UNKNOWN BIT(MEM_UNKNOWN) #define MEM_FLAG_FPM BIT(MEM_FPM) #define MEM_FLAG_EDO BIT(MEM_EDO) #define MEM_FLAG_BEDO BIT(MEM_BEDO) #define MEM_FLAG_SDR BIT(MEM_SDR) #define MEM_FLAG_RDR BIT(MEM_RDR) #define MEM_FLAG_DDR BIT(MEM_DDR) #define MEM_FLAG_RDDR BIT(MEM_RDDR) #define MEM_FLAG_RMBS BIT(MEM_RMBS) #define MEM_FLAG_DDR2 BIT(MEM_DDR2) #define MEM_FLAG_FB_DDR2 BIT(MEM_FB_DDR2) #define MEM_FLAG_RDDR2 BIT(MEM_RDDR2) #define MEM_FLAG_XDR BIT(MEM_XDR) #define MEM_FLAG_DDR3 BIT(MEM_DDR3) #define MEM_FLAG_RDDR3 BIT(MEM_RDDR3) #define MEM_FLAG_DDR4 BIT(MEM_DDR4) #define MEM_FLAG_RDDR4 BIT(MEM_RDDR4) /** * enum edac-type - Error Detection and Correction capabilities and mode * @EDAC_UNKNOWN: Unknown if ECC is available * @EDAC_NONE: Doesn't support ECC * @EDAC_RESERVED: Reserved ECC type * @EDAC_PARITY: Detects parity errors * @EDAC_EC: Error Checking - no correction * @EDAC_SECDED: Single bit error correction, Double detection * @EDAC_S2ECD2ED: Chipkill x2 devices - do these exist? * @EDAC_S4ECD4ED: Chipkill x4 devices * @EDAC_S8ECD8ED: Chipkill x8 devices * @EDAC_S16ECD16ED: Chipkill x16 devices */ enum edac_type { EDAC_UNKNOWN = 0, EDAC_NONE, EDAC_RESERVED, EDAC_PARITY, EDAC_EC, EDAC_SECDED, EDAC_S2ECD2ED, EDAC_S4ECD4ED, EDAC_S8ECD8ED, EDAC_S16ECD16ED, }; #define EDAC_FLAG_UNKNOWN BIT(EDAC_UNKNOWN) #define EDAC_FLAG_NONE BIT(EDAC_NONE) #define EDAC_FLAG_PARITY BIT(EDAC_PARITY) #define EDAC_FLAG_EC BIT(EDAC_EC) #define EDAC_FLAG_SECDED BIT(EDAC_SECDED) #define EDAC_FLAG_S2ECD2ED BIT(EDAC_S2ECD2ED) #define EDAC_FLAG_S4ECD4ED BIT(EDAC_S4ECD4ED) #define EDAC_FLAG_S8ECD8ED BIT(EDAC_S8ECD8ED) #define EDAC_FLAG_S16ECD16ED BIT(EDAC_S16ECD16ED) /** * enum scrub_type - scrubbing capabilities * @SCRUB_UNKNOWN Unknown if scrubber is available * @SCRUB_NONE: No scrubber * @SCRUB_SW_PROG: SW progressive (sequential) scrubbing * @SCRUB_SW_SRC: Software scrub only errors * @SCRUB_SW_PROG_SRC: Progressive software scrub from an error * @SCRUB_SW_TUNABLE: Software scrub frequency is tunable * @SCRUB_HW_PROG: HW progressive (sequential) scrubbing * @SCRUB_HW_SRC: Hardware scrub only errors * @SCRUB_HW_PROG_SRC: Progressive hardware scrub from an error * SCRUB_HW_TUNABLE: Hardware scrub frequency is tunable */ enum scrub_type { SCRUB_UNKNOWN = 0, SCRUB_NONE, SCRUB_SW_PROG, SCRUB_SW_SRC, SCRUB_SW_PROG_SRC, SCRUB_SW_TUNABLE, SCRUB_HW_PROG, SCRUB_HW_SRC, SCRUB_HW_PROG_SRC, SCRUB_HW_TUNABLE }; #define SCRUB_FLAG_SW_PROG BIT(SCRUB_SW_PROG) #define SCRUB_FLAG_SW_SRC BIT(SCRUB_SW_SRC) #define SCRUB_FLAG_SW_PROG_SRC BIT(SCRUB_SW_PROG_SRC) #define SCRUB_FLAG_SW_TUN BIT(SCRUB_SW_SCRUB_TUNABLE) #define SCRUB_FLAG_HW_PROG BIT(SCRUB_HW_PROG) #define SCRUB_FLAG_HW_SRC BIT(SCRUB_HW_SRC) #define SCRUB_FLAG_HW_PROG_SRC BIT(SCRUB_HW_PROG_SRC) #define SCRUB_FLAG_HW_TUN BIT(SCRUB_HW_TUNABLE) /* FIXME - should have notify capabilities: NMI, LOG, PROC, etc */ /* EDAC internal operation states */ #define OP_ALLOC 0x100 #define OP_RUNNING_POLL 0x201 #define OP_RUNNING_INTERRUPT 0x202 #define OP_RUNNING_POLL_INTR 0x203 #define OP_OFFLINE 0x300 /* * Concepts used at the EDAC subsystem * * There are several things to be aware of that aren't at all obvious: * * SOCKETS, SOCKET SETS, BANKS, ROWS, CHIP-SELECT ROWS, CHANNELS, etc.. * * These are some of the many terms that are thrown about that don't always * mean what people think they mean (Inconceivable!). In the interest of * creating a common ground for discussion, terms and their definitions * will be established. * * Memory devices: The individual DRAM chips on a memory stick. These * devices commonly output 4 and 8 bits each (x4, x8). * Grouping several of these in parallel provides the * number of bits that the memory controller expects: * typically 72 bits, in order to provide 64 bits + * 8 bits of ECC data. * * Memory Stick: A printed circuit board that aggregates multiple * memory devices in parallel. In general, this is the * Field Replaceable Unit (FRU) which gets replaced, in * the case of excessive errors. Most often it is also * called DIMM (Dual Inline Memory Module). * * Memory Socket: A physical connector on the motherboard that accepts * a single memory stick. Also called as "slot" on several * datasheets. * * Channel: A memory controller channel, responsible to communicate * with a group of DIMMs. Each channel has its own * independent control (command) and data bus, and can * be used independently or grouped with other channels. * * Branch: It is typically the highest hierarchy on a * Fully-Buffered DIMM memory controller. * Typically, it contains two channels. * Two channels at the same branch can be used in single * mode or in lockstep mode. * When lockstep is enabled, the cacheline is doubled, * but it generally brings some performance penalty. * Also, it is generally not possible to point to just one * memory stick when an error occurs, as the error * correction code is calculated using two DIMMs instead * of one. Due to that, it is capable of correcting more * errors than on single mode. * * Single-channel: The data accessed by the memory controller is contained * into one dimm only. E. g. if the data is 64 bits-wide, * the data flows to the CPU using one 64 bits parallel * access. * Typically used with SDR, DDR, DDR2 and DDR3 memories. * FB-DIMM and RAMBUS use a different concept for channel, * so this concept doesn't apply there. * * Double-channel: The data size accessed by the memory controller is * interlaced into two dimms, accessed at the same time. * E. g. if the DIMM is 64 bits-wide (72 bits with ECC), * the data flows to the CPU using a 128 bits parallel * access. * * Chip-select row: This is the name of the DRAM signal used to select the * DRAM ranks to be accessed. Common chip-select rows for * single channel are 64 bits, for dual channel 128 bits. * It may not be visible by the memory controller, as some * DIMM types have a memory buffer that can hide direct * access to it from the Memory Controller. * * Single-Ranked stick: A Single-ranked stick has 1 chip-select row of memory. * Motherboards commonly drive two chip-select pins to * a memory stick. A single-ranked stick, will occupy * only one of those rows. The other will be unused. * * Double-Ranked stick: A double-ranked stick has two chip-select rows which * access different sets of memory devices. The two * rows cannot be accessed concurrently. * * Double-sided stick: DEPRECATED TERM, see Double-Ranked stick. * A double-sided stick has two chip-select rows which * access different sets of memory devices. The two * rows cannot be accessed concurrently. "Double-sided" * is irrespective of the memory devices being mounted * on both sides of the memory stick. * * Socket set: All of the memory sticks that are required for * a single memory access or all of the memory sticks * spanned by a chip-select row. A single socket set * has two chip-select rows and if double-sided sticks * are used these will occupy those chip-select rows. * * Bank: This term is avoided because it is unclear when * needing to distinguish between chip-select rows and * socket sets. * * Controller pages: * * Physical pages: * * Virtual pages: * * * STRUCTURE ORGANIZATION AND CHOICES * * * * PS - I enjoyed writing all that about as much as you enjoyed reading it. */ /** * enum edac_mc_layer - memory controller hierarchy layer * * @EDAC_MC_LAYER_BRANCH: memory layer is named "branch" * @EDAC_MC_LAYER_CHANNEL: memory layer is named "channel" * @EDAC_MC_LAYER_SLOT: memory layer is named "slot" * @EDAC_MC_LAYER_CHIP_SELECT: memory layer is named "chip select" * @EDAC_MC_LAYER_ALL_MEM: memory layout is unknown. All memory is mapped * as a single memory area. This is used when * retrieving errors from a firmware driven driver. * * This enum is used by the drivers to tell edac_mc_sysfs what name should * be used when describing a memory stick location. */ enum edac_mc_layer_type { EDAC_MC_LAYER_BRANCH, EDAC_MC_LAYER_CHANNEL, EDAC_MC_LAYER_SLOT, EDAC_MC_LAYER_CHIP_SELECT, EDAC_MC_LAYER_ALL_MEM, }; /** * struct edac_mc_layer - describes the memory controller hierarchy * @layer: layer type * @size: number of components per layer. For example, * if the channel layer has two channels, size = 2 * @is_virt_csrow: This layer is part of the "csrow" when old API * compatibility mode is enabled. Otherwise, it is * a channel */ struct edac_mc_layer { enum edac_mc_layer_type type; unsigned size; bool is_virt_csrow; }; /* * Maximum number of layers used by the memory controller to uniquely * identify a single memory stick. * NOTE: Changing this constant requires not only to change the constant * below, but also to change the existing code at the core, as there are * some code there that are optimized for 3 layers. */ #define EDAC_MAX_LAYERS 3 /** * EDAC_DIMM_OFF - Macro responsible to get a pointer offset inside a pointer array * for the element given by [layer0,layer1,layer2] position * * @layers: a struct edac_mc_layer array, describing how many elements * were allocated for each layer * @n_layers: Number of layers at the @layers array * @layer0: layer0 position * @layer1: layer1 position. Unused if n_layers < 2 * @layer2: layer2 position. Unused if n_layers < 3 * * For 1 layer, this macro returns &var[layer0] - &var * For 2 layers, this macro is similar to allocate a bi-dimensional array * and to return "&var[layer0][layer1] - &var" * For 3 layers, this macro is similar to allocate a tri-dimensional array * and to return "&var[layer0][layer1][layer2] - &var" * * A loop could be used here to make it more generic, but, as we only have * 3 layers, this is a little faster. * By design, layers can never be 0 or more than 3. If that ever happens, * a NULL is returned, causing an OOPS during the memory allocation routine, * with would point to the developer that he's doing something wrong. */ #define EDAC_DIMM_OFF(layers, nlayers, layer0, layer1, layer2) ({ \ int __i; \ if ((nlayers) == 1) \ __i = layer0; \ else if ((nlayers) == 2) \ __i = (layer1) + ((layers[1]).size * (layer0)); \ else if ((nlayers) == 3) \ __i = (layer2) + ((layers[2]).size * ((layer1) + \ ((layers[1]).size * (layer0)))); \ else \ __i = -EINVAL; \ __i; \ }) /** * EDAC_DIMM_PTR - Macro responsible to get a pointer inside a pointer array * for the element given by [layer0,layer1,layer2] position * * @layers: a struct edac_mc_layer array, describing how many elements * were allocated for each layer * @var: name of the var where we want to get the pointer * (like mci->dimms) * @n_layers: Number of layers at the @layers array * @layer0: layer0 position * @layer1: layer1 position. Unused if n_layers < 2 * @layer2: layer2 position. Unused if n_layers < 3 * * For 1 layer, this macro returns &var[layer0] * For 2 layers, this macro is similar to allocate a bi-dimensional array * and to return "&var[layer0][layer1]" * For 3 layers, this macro is similar to allocate a tri-dimensional array * and to return "&var[layer0][layer1][layer2]" */ #define EDAC_DIMM_PTR(layers, var, nlayers, layer0, layer1, layer2) ({ \ typeof(*var) __p; \ int ___i = EDAC_DIMM_OFF(layers, nlayers, layer0, layer1, layer2); \ if (___i < 0) \ __p = NULL; \ else \ __p = (var)[___i]; \ __p; \ }) struct dimm_info { struct device dev; char label[EDAC_MC_LABEL_LEN + 1]; /* DIMM label on motherboard */ /* Memory location data */ unsigned location[EDAC_MAX_LAYERS]; struct mem_ctl_info *mci; /* the parent */ u32 grain; /* granularity of reported error in bytes */ enum dev_type dtype; /* memory device type */ enum mem_type mtype; /* memory dimm type */ enum edac_type edac_mode; /* EDAC mode for this dimm */ u32 nr_pages; /* number of pages on this dimm */ unsigned csrow, cschannel; /* Points to the old API data */ }; /** * struct rank_info - contains the information for one DIMM rank * * @chan_idx: channel number where the rank is (typically, 0 or 1) * @ce_count: number of correctable errors for this rank * @csrow: A pointer to the chip select row structure (the parent * structure). The location of the rank is given by * the (csrow->csrow_idx, chan_idx) vector. * @dimm: A pointer to the DIMM structure, where the DIMM label * information is stored. * * FIXME: Currently, the EDAC core model will assume one DIMM per rank. * This is a bad assumption, but it makes this patch easier. Later * patches in this series will fix this issue. */ struct rank_info { int chan_idx; struct csrow_info *csrow; struct dimm_info *dimm; u32 ce_count; /* Correctable Errors for this csrow */ }; struct csrow_info { struct device dev; /* Used only by edac_mc_find_csrow_by_page() */ unsigned long first_page; /* first page number in csrow */ unsigned long last_page; /* last page number in csrow */ unsigned long page_mask; /* used for interleaving - * 0UL for non intlv */ int csrow_idx; /* the chip-select row */ u32 ue_count; /* Uncorrectable Errors for this csrow */ u32 ce_count; /* Correctable Errors for this csrow */ struct mem_ctl_info *mci; /* the parent */ /* channel information for this csrow */ u32 nr_channels; struct rank_info **channels; }; /* * struct errcount_attribute - used to store the several error counts */ struct errcount_attribute_data { int n_layers; int pos[EDAC_MAX_LAYERS]; int layer0, layer1, layer2; }; /** * edac_raw_error_desc - Raw error report structure * @grain: minimum granularity for an error report, in bytes * @error_count: number of errors of the same type * @top_layer: top layer of the error (layer[0]) * @mid_layer: middle layer of the error (layer[1]) * @low_layer: low layer of the error (layer[2]) * @page_frame_number: page where the error happened * @offset_in_page: page offset * @syndrome: syndrome of the error (or 0 if unknown or if * the syndrome is not applicable) * @msg: error message * @location: location of the error * @label: label of the affected DIMM(s) * @other_detail: other driver-specific detail about the error * @enable_per_layer_report: if false, the error affects all layers * (typically, a memory controller error) */ struct edac_raw_error_desc { /* * NOTE: everything before grain won't be cleaned by * edac_raw_error_desc_clean() */ char location[LOCATION_SIZE]; char label[(EDAC_MC_LABEL_LEN + 1 + sizeof(OTHER_LABEL)) * EDAC_MAX_LABELS]; long grain; /* the vars below and grain will be cleaned on every new error report */ u16 error_count; int top_layer; int mid_layer; int low_layer; unsigned long page_frame_number; unsigned long offset_in_page; unsigned long syndrome; const char *msg; const char *other_detail; bool enable_per_layer_report; }; /* MEMORY controller information structure */ struct mem_ctl_info { struct device dev; struct bus_type *bus; struct list_head link; /* for global list of mem_ctl_info structs */ struct module *owner; /* Module owner of this control struct */ unsigned long mtype_cap; /* memory types supported by mc */ unsigned long edac_ctl_cap; /* Mem controller EDAC capabilities */ unsigned long edac_cap; /* configuration capabilities - this is * closely related to edac_ctl_cap. The * difference is that the controller may be * capable of s4ecd4ed which would be listed * in edac_ctl_cap, but if channels aren't * capable of s4ecd4ed then the edac_cap would * not have that capability. */ unsigned long scrub_cap; /* chipset scrub capabilities */ enum scrub_type scrub_mode; /* current scrub mode */ /* Translates sdram memory scrub rate given in bytes/sec to the internal representation and configures whatever else needs to be configured. */ int (*set_sdram_scrub_rate) (struct mem_ctl_info * mci, u32 bw); /* Get the current sdram memory scrub rate from the internal representation and converts it to the closest matching bandwidth in bytes/sec. */ int (*get_sdram_scrub_rate) (struct mem_ctl_info * mci); /* pointer to edac checking routine */ void (*edac_check) (struct mem_ctl_info * mci); /* * Remaps memory pages: controller pages to physical pages. * For most MC's, this will be NULL. */ /* FIXME - why not send the phys page to begin with? */ unsigned long (*ctl_page_to_phys) (struct mem_ctl_info * mci, unsigned long page); int mc_idx; struct csrow_info **csrows; unsigned nr_csrows, num_cschannel; /* * Memory Controller hierarchy * * There are basically two types of memory controller: the ones that * sees memory sticks ("dimms"), and the ones that sees memory ranks. * All old memory controllers enumerate memories per rank, but most * of the recent drivers enumerate memories per DIMM, instead. * When the memory controller is per rank, csbased is true. */ unsigned n_layers; struct edac_mc_layer *layers; bool csbased; /* * DIMM info. Will eventually remove the entire csrows_info some day */ unsigned tot_dimms; struct dimm_info **dimms; /* * FIXME - what about controllers on other busses? - IDs must be * unique. dev pointer should be sufficiently unique, but * BUS:SLOT.FUNC numbers may not be unique. */ struct device *pdev; const char *mod_name; const char *mod_ver; const char *ctl_name; const char *dev_name; void *pvt_info; unsigned long start_time; /* mci load start time (in jiffies) */ /* * drivers shouldn't access those fields directly, as the core * already handles that. */ u32 ce_noinfo_count, ue_noinfo_count; u32 ue_mc, ce_mc; u32 *ce_per_layer[EDAC_MAX_LAYERS], *ue_per_layer[EDAC_MAX_LAYERS]; struct completion complete; /* Additional top controller level attributes, but specified * by the low level driver. * * Set by the low level driver to provide attributes at the * controller level. * An array of structures, NULL terminated * * If attributes are desired, then set to array of attributes * If no attributes are desired, leave NULL */ const struct mcidev_sysfs_attribute *mc_driver_sysfs_attributes; /* work struct for this MC */ struct delayed_work work; /* * Used to report an error - by being at the global struct * makes the memory allocated by the EDAC core */ struct edac_raw_error_desc error_desc; /* the internal state of this controller instance */ int op_state; struct dentry *debugfs; u8 fake_inject_layer[EDAC_MAX_LAYERS]; bool fake_inject_ue; u16 fake_inject_count; }; /* * Maximum number of memory controllers in the coherent fabric. */ #define EDAC_MAX_MCS 16 #endif

Overall Contributors

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mauro carvalho chehabmauro carvalho chehab93883.16%1957.58%
gong chengong chen686.03%26.06%
dave jiangdave jiang524.61%26.06%
hitoshi mitakehitoshi mitake292.57%13.03%
borislav petkovborislav petkov151.33%26.06%
jim snowjim snow80.71%13.03%
paul gortmakerpaul gortmaker70.62%13.03%
aristeu sergio rozanski filhoaristeu sergio rozanski filho40.35%13.03%
aravind gopalakrishnanaravind gopalakrishnan30.27%13.03%
kay sieverskay sievers20.18%13.03%
viresh kumarviresh kumar10.09%13.03%
arun sharmaarun sharma10.09%13.03%
Total1128100.00%33100.00%
Directory: include/linux
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